H01L2224/63 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto Connectors not provided for in any of the groups  -  and subgroups; Manufacturing methods related thereto

• H01L2224/64 » Manufacturing methods 7
• H01L2224/65 » Structure, shape, material or disposition of the connectors prior to the connecting process 0
• H01L2224/68 » Structure, shape, material or disposition of the connectors after the connecting process 0