210125 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Connectors not provided for in any of the groups - and subgroups; Manufacturing methods related thereto Manufacturing methods
VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
#2Using MEMS fabrication incorporating into LED device mounting and assembly
#3Via and trench filling using injection molded soldering
#4Via and trench filling using injection molded soldering
#5Via and trench filling using injection molded soldering
#6Using MEMS fabrication incorporating into LED device mounting and assembly
#7Formation of connectors without UBM
#8Via and trench filling using injection molded soldering