210127 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Connectors not provided for in any of the groups - and subgroups; Manufacturing methods related thereto; Structure, shape, material or disposition of the connectors prior to the connecting process of an individual connector
SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
#2MICRO BONDING DEVICE, BONDING BACKPLANE AND DISPLAY DEVICE
#3Cap for a chip device having a groove, device provided with said cap, assembly consisting of the device and a wire element, and manufacturing method thereof