210128 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Connectors not provided for in any of the groups - and subgroups; Manufacturing methods related thereto; Structure, shape, material or disposition of the connectors prior to the connecting process of a plurality of connectors
SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
#2Chip socket, testing fixture and chip testing method thereof
#3Chip socket, testing fixture and chip testing method thereof
#4Electrical connectors having a bent main body for electrical connection between a housing and a support, and being disposed as a grid array or network