H01L2224/71 - CPC Classification Index

ClassID:

210132 ⎘

H01L2224/71 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by Means for bonding not being attached to, or not being formed on, the surface to be connected

Sub-classes:

H01L2224/72 » Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips 55

Recent Application in this class:

20240355759

2024-10-24

LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DAMAGE

20230115289

2023-04-13

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE