210133 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding not being attached to, or not being formed on, the surface to be connected Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
SEMICONDUCTOR DEVICE
#2Package with Vertical Electronic Components Held Together by a Clip
#3POWER SEMICONDUCTOR MODULE HAVING A METALLIC CLIP WITH ULTRASONICALLY WELDED CONTACT REGIONS AND METHOD OF PRODUCING THE POWER SEMICONDUCTOR MODULE
#4REMOTE HEAT SINK SIDE ATTACH METHODOLOGY
#5Multi-Chip Package with Detachable Chips
#6INTERCONNECTION STRUCTURE FOR INTEGRATED CIRCUIT PACKAGE
#7SEMICONDUCTOR DEVICE
#8Cold plates incorporating reactive multilayer systems and S-cells
#9DISPLAY DEVICE
#10MEMORY ON PACKAGE WITH INTERPOSER WITH COMPRESSION-BASED CONNECTORS
#11INTERCONNECTION STRUCTURE FOR INTEGRATED CIRCUIT PACKAGE AND THE METHOD THEREOF
#12THREE-DIMENSIONAL CIRCUITS WITH FLEXIBLE INTERCONNECTS
#13Hybrid short circuit failure mode preform for power semiconductor devices
#14Pressure-contact-type semiconductor device
#15Connectors for interconnecting microelectronic circuits
#16Semiconductor package with elastic coupler and related methods
#17Power semiconductor module with short circuit failure mode
#18Semiconductor device with integrated shunt resistor
#19Semiconductor power module comprising graphene
#20Semiconductor package with elastic coupler and related methods
#21Microspring structure for hardware trusted platform module
#22Solar cell module and conductor
#23Semiconductor package with elastic coupler and related methods
#24Semiconductor device including a clip
#25Semiconductor device including a clip
#26Semiconductor package with elastic coupler and related methods
#27Cap for a chip device having a groove, device provided with said cap, assembly consisting of the device and a wire element, and manufacturing method thereof
#28Hybrid-integrated photonic chip package with an interposer
#29Hybrid-integrated photonic chip package with an interposer
#30Batch process for three-dimensional integration
#31Maintaining alignment in a multi-chip module using a compressible structure
#32Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and electrically conductive second connector
#33Semiconductor device
#34Power module for an automobile
#35Semi-conductor chip with compressible contact structure and electronic package utilizing same
#36THERMAL FLEX CONTACT CARRIERS #2
#37Transistor assembly and method for manufacturing the same
#38Integrated-circuit package for proximity communication
#39Top exposed clip with window array
#40Integrated-circuit package for proximity communication
#41TFCC (TM) and SWCC (TM) thermal flex contact carriers
#42Bumpless flip-chip assembly with a complaint interposer contractor
#43Power semiconductor packaging method and structure
#44Interconnections resistant to wicking
#45METHOD FOR PROCESSING AN INTEGRATED CIRCUIT
#46Semiconductor device with semiconductor chips mounted on mounting board via conductive anaotubes
#47Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
#48Probe For Semiconductor Devices
#49Chip on a board
#50Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure
#51MEMORY ELEMENT CONDUCTING STRUCTURE
#52Methods and apparatus for interconnecting a ball grid array to a printed circuit board
#53SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES
#54Layered microelectronic contact and method for fabricating same
#55Probe for semiconductor devices
#56Structure for controlled shock and vibration of electrical interconnects
#57Method for processing an integrated circuit
#58Semiconductor package with heat sink