210139 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being of different types provided for in two or more of groups; Location prior to the connecting process on different surfaces
Sub-classes:SEMICONDUCTOR DEVICE
#2Semiconductor module
#3Semiconductor package structure and method for manufacturing the same
#4Semiconductor device and method of manufacturing the same
#5Fan-out pop stacking process
#6Method of manufacturing a semiconductor device and semiconductor integrated circuit wafer
#7Small footprint semiconductor package
#8Chip package and a method for manufacturing a chip package
#9METHODS FOR CONTROLLING WAFER AND PACKAGE WARPAGE DURING ASSEMBLY OF VERY THIN DIE