210140 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being of different types provided for in two or more of groups; Location prior to the connecting process on different surfaces Bump and layer connectors
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION
#2SEMICONDUCTOR PACKAGE WITH DOUBLE-SIDED THERMAL SOLUTION AND METHOD FOR FORMING THE SAME
#3CONDUCTIVE PASTE VSS SHORTING FOR GROUND BUMPS
#4INTEGRATED CIRCUIT DEVICE INCLUDING A HIGH THERMAL CONDUCTIVITY ELECTRICALLY INSULATING STRUCTURE
#5CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#6CHIP PACKAGE ASSEMBLY WITH ON-PACKAGE CONTAINMENT SYSTEM
#7SEMICONDUCTOR PACKAGE STRUCTURE AND BYPRODUCT OF SEMICONDUCTOR COMPONENT
#8SEMICONDUCTOR PACKAGE WITH DOUBLE-SIDED THERMAL SOLUTION AND METHOD FOR FORMING THE SAME
#9INTEGRATED CIRCUIT DEVICE INCLUDING A HIGH THERMAL CONDUCTIVITY ELECTRICALLY INSULATING STRUCTURE
#10SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD FOR MAKING THE SAME
#11EMBEDDED INTEGRATED STACK CAPACITOR (ISC) IN SUBSTRATE BUILD-UP LAYER
#12HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
#13SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODULE, AND METHODS OF FORMING THE SEMICONDUCTOR DIE AND THE SEMICONDUCTOR DIE STACK
#14METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC COMPONENTS
#15COMPOUND COMPONENT DEVICE AND METHOD OF MANUFACTURING THE SAME
#16DISPLAY DEVICE
#17ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#18DISPLAY DEVICE INCLUDING A WIRING PAD AND METHOD FOR MANUFACTURING THE SAME
#19Semiconductor die, a semiconductor die stack, and a semiconductor module
#20IMAGE SENSOR PACKAGE AND SYSTEM HAVING THE SAME
#21Semiconductor device with enhanced thermal dissipation and method for making the same
#22Semiconductor device and manufacturing method for semiconductor device
#23Package substrates with magnetic build-up layers
#24SYSTEMS AND METHODS FOR FLASH STACKING
#25Semiconductor module having an N terminal, A P terminal and an output terminal and method of fabricating the semiconductor module
#26Systems and methods for flash stacking
#27Semiconductor device with enhanced thermal dissipation and method for making the same
#28Molded wafer level packaging
#29Fan-out packages and methods of forming the same
#30Systems and methods for flash stacking
#31Systems and methods for electromagnetic interference shielding
#32SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRIBUTED PADS
#33SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
#34Systems and methods for electromagnetic interference shielding
#35Automated optical inspection of unit specific patterning
#36Semiconductor package, semiconductor device using the same and manufacturing method thereof
#37Semiconductor device and corresponding method
#38Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC)
#39Semiconductor package with conductive clip
#40Power semiconductor device and the preparation method
#41Wafer process for molded chip scale package (MCSP) with thick backside metallization
#42Semiconductor package with conductive clip
#43Power semiconductor package with conductive clip and related method
#44SEMICONDUCTOR DEVICE AND INTERCONNECT SUBSTRATE
#45Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements
#46Wafer scale package for high power devices
#47Wafer level chip scale package with exposed thick bottom metal
#48Wafer process for molded chip scale package (MCSP) with thick backside metallization
#49Chip package and method for forming the same
#50Semiconductor package for high power devices
#51Embedded electrical component surface interconnect
#52Power semiconductor device with reduced contact resistance
#53Semiconductor package having internal shunt and solder stop dimples
#54Wafer level chip scale package with thick bottom metal exposed and preparation method thereof
#55Structure and method for power field effect transistor
#56Method for fabricating 3D integrated circuit device using interface wafer as permanent carrier
#573D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer
#58Vertical MOSFET device
#59Chip package and method for forming the same
#60Wafer level molding structure
#61Power semiconductor package
#62Lid for an electrical hardware component
#63Package for high power devices
#64Wafer scale package for high power devices
#65IC PACKAGE STIFFENER WITH BEAM
#66Semiconductor device package having a buffer structure and method of fabricating the same
#67Vertical MOSFET with through-body via for gate
#68Semiconductor package of a flipped MOSFET and its manufacturing method
#69Semiconductor device
#70NICKEL-TITANUM SOLDERING LAYERS IN SEMICONDUCTOR DEVICES
#71Flip chip MLP with folded heat sink
#72Method for fabricating a 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer
#73Structure and method for power field effect transistor
#74Semiconductor device
#753D integrated circuit device fabrication using interface wafer as permanent carrier
#76Vertical MOSFET with through-body via for gate
#77Semiconductor chip assembly
#78Integrated module for data processing system
#79Semiconductor module
#80SEMICONDUCTOR PACKAGE WITH STACKED DIE ASSEMBLY
#81Semiconductor module
#82Semiconductor device having a gate contact on one surface electrically connected to a gate bus on an opposing surface
#83Autoclave capable chip-scale package
#84Integrated module for data processing system
#85MOLDED PACKAGE ASSEMBLY
#86Method of manufacturing electronic device on leadframe
#87Semiconductor device
#88Conductive chip-scale package
#89SEMICONDUCTOR MODULE MOUNTING STRUCTURE
#90SEMICONDUCTOR DIE PACKAGE INCLUDING STAND OFF STRUCTURES
#91Semiconductor device having metal cap divided by slit
#92INTEGRATED CIRCUIT PACKAGE WITH SOLDERED LID FOR IMPROVED THERMAL PERFORMANCE
#93SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#94Arrangement for high frequency application
#95Paste for forming an interconnect and interconnect formed from the paste
#96Semiconductor component and method of manufacture
#97Semiconductor device
#98Method for manufacturing semiconductor device with reduced damage to metal wiring layer
#99Semiconductor package
#100Semiconductor device
#101Process of fabricating a semiconductor package
#102Semiconductor device with reduced contact resistance
#103Electronic package and semiconductor device using the same
#104Bond wireless power module with double-sided single device cooling and immersion bath cooling
#105Semiconductor device package utilizing proud interconnect material
#106Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules
#107Electronic component having a semiconductor power device
#108Flip chip MLP with folded heat sink
#109Method of producing an electronic component
#110Interconnection structure, electronic component and method of manufacturing the same
#111Semiconductor module
#112SEMICONDUCTOR MODULE
#113Hard disk drive preamp heat dissipation methods
#114Low inductance bond-wireless co-package for high power density devices, especially for IGBTs and diodes
#115Process for fabricating a semiconductor package
#116SEMICONDUCTOR DEVICE WITH SOLDERABLE LOOP CONTACTS
#117Electronic component having exposed surfaces
#118Chip-scale package
#119Semiconductor device
#120Semiconductor device and method of manufacturing the same
#121Semiconductor package
#122Redistributed solder pads using etched lead frame
#123Substrate and method for mounting silicon device
#124Package for high power density devices
#125DEVICE AND METHOD FOR ASSEMBLING A TOP AND BOTTOM EXPOSED PACKAGED SEMICONDUCTOR
#126Semiconductor package including a semiconductor die having redistributed pads
#127Semiconductor package that includes stacked semiconductor die
#128Thermally enhanced power semiconductor package system
#129Semiconductor package with redistributed pads
#130IMS formed as can for semiconductor housing
#131Semiconductor component and methods to produce a semiconductor component
#132Direct FET device for high frequency application
#133Semiconductor device and circuit board
#134Process of manufacture of ultra thin semiconductor wafers with bonded conductive hard carrier
#135Chip-scale package
#136Chip-scale package
#137Semiconductor package
#138Chip scale surface mounted device and process of manufacture
#139Semiconductor device and method of manufacturing the same
#140Carrier with metal bumps for semiconductor die packages
#141Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys
#142Audio amplifier assembly
#143Redistributed solder pads using etched lead frame
#144Semiconductor module
#145Semiconductor device with reduced contact resistance
#146Semiconductor device
#147Electronic package and semiconductor device using the same
#148Semiconductor device with reduced contact resistance
#149Preparation of front contact for surface mounting
#150Electronic device including chip parts and a method for manufacturing the same
#151Semiconductor device
#152Surface mounted package with die bottom spaced from support board
#153Chip scale surface mounted device and process of manufacture
#154Method of making microelectronic packages including electrically and/or thermally conductive element
#155Semiconductor device with a solder creep-up prevention zone
#156Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate
#157Semiconductor device package utilizing proud interconnect material
#158Paste for forming an interconnect and interconnect formed from the paste
#159Semiconductor device including a semiconductor chip mounted on a metal base
#160Semiconductor apparatus and method of manufacturing the same
#161Semiconductor device
#162Systems and methods for flash stacking