PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

Coupling assembly of power semiconductor device and PCB and method for manufacturing the same

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

Power module for an automobile

Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect Structures

Integrated circuit package system with package stacking and method of manufacture thereof

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers

Stack-type semiconductor device having chips having different backside structure and electronic apparatus including the same

Semiconductor device and adhesive sheet

High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same

Double-sided semiconductor device and method of forming top-side and bottom-side interconnect structures

Semiconductor die packages having overlapping dice, system using the same, and methods of making the same

SEMICONDUCTOR PACKAGES WITH THERMAL INTERFACE MATERIALS

High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same

Semiconductor package having restraining ring surfaces against soldering crack

Low inductance bond-wireless co-package for high power density devices, especially for IGBTs and diodes