210159 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being of different types provided for in two or more of groups; Location after the connecting process on different surfaces
Sub-classes:SEMICONDUCTOR DEVICE AND METHOD HAVING HIGH-KAPPA BONDING LAYER
#2SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#3SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
#4SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS
#5RADIATOR LAYERS FOR ULTRASONIC TRANSDUCERS
#6Cold plates incorporating reactive multilayer systems and S-cells
#7SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#8Packaging method and package structure
#9Semiconductor device including penetration via structure
#10SEMICONDUCTOR DEVICE AND METHOD HAVING HIGH-KAPPA BONDING LAYER
#11SEMICONDUCTOR PACKAGE
#12SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#13Semiconductor packages with pass-through clock traces and associated systems and methods
#14SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF
#15Power module
#16Soldering structure with groove portion and power module comprising the same
#17Connectors for interconnecting microelectronic circuits
#18Semiconductor storage device and method of manufacturing the same
#19ELECTRONICS PACKAGING USING ORGANIC ELECTRICALLY INSULATING LAYERS
#20Electronic Assembly With a Component Located Between Two Substrates, and Method for Producing Same
#21Semiconductor device structure and method for forming the same
#22Semiconductor Devices and Methods of Manufacture Thereof
#23Fan-out semiconductor package
#24Electronic system having increased coupling by using horizontal and vertical communication channels
#25Method of manufacturing semiconductor device and semiconductor device
#26Semiconductor device
#27Power converter monolithically integrating transistors, carrier, and components
#28Using MEMS fabrication incorporating into LED device mounting and assembly
#29Semiconductor device structure and method for forming the same
#30Electronic system having increased coupling by using horizontal and vertical communication channels
#31Power module having power device connected between heat sink and drive unit
#32Electronic system having increased coupling by using horizontal and vertical communication channels
#33Method of manufacturing semiconductor devices having conductive plugs with varying widths
#34Strip-type substrate for producing chip card modules
#35Semiconductor device and manufacturing method thereof
#36Power converter monolithically integrating transistors, carrier, and components
#37Semiconductor device and semiconductor device manufacturing method
#38Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
#39Semiconductor devices having stacked structures and methods for fabricating the same
#40Using MEMS fabrication incorporating into LED device mounting and assembly
#41Semiconductor device
#42Electrical connector
#43Small footprint semiconductor package
#44Component built-in board and method of manufacturing the same, and component built-in board mounting body
#45Making an integrated circuit module with dual leadframes
#46Flattened substrate surface for substrate bonding
#47Adjustable heat pipe thermal unit
#48METHOD AND APPARATUS PROVIDING INTEGRATED CIRCUIT SYSTEM WITH INTERCONNECTED STACKED DEVICE WAFERS
#49Electronic system having increased coupling by using horizontal and vertical communication channels
#50Maintaining alignment in a multi-chip module using a compressible structure
#51Flattened substrate surface for substrate bonding
#52Semiconductor device
#53Semi-conductor chip with compressible contact structure and electronic package utilizing same
#54THERMAL FLEX CONTACT CARRIERS #2
#55STACK PACKAGE
#56Integrated-circuit package for proximity communication
#57Top exposed clip with window array
#58Integrated-circuit package for proximity communication
#59TFCC (TM) and SWCC (TM) thermal flex contact carriers
#60Bumpless flip-chip assembly with a complaint interposer contractor
#61Interconnections resistant to wicking
#62METHOD FOR PROCESSING AN INTEGRATED CIRCUIT
#63Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
#64Probe For Semiconductor Devices
#65Chip on a board
#66Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure
#67MEMORY ELEMENT CONDUCTING STRUCTURE
#68Methods and apparatus for interconnecting a ball grid array to a printed circuit board
#69SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES
#70Layered microelectronic contact and method for fabricating same
#71Probe for semiconductor devices
#72Method for processing an integrated circuit
#73Package to die connection system and method therefor