210145 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being of different types provided for in two or more of groups; Location after the connecting process on the same surface Bump and strap connectors
SENSOR PACKAGES
#2METHOD FOR PRODUCING A CIRCUIT ARRANGEMENT FOR AN ELECTRIC MACHINE, POWER SEMICONDUCTOR MODULE FOR A CIRCUIT ARRANGEMENT, AND CORRESPONDING CIRCUIT ARRANGEMENT
#33D GATE CONTROL CONNECTION OF A POWER MODULE WITH AT LEAST ONE CONTROLLED POWER SEMICONDUCTOR DIE
#4Fingerprint sensor package and smart card having the same
#5PACKAGE DEVICE PREVENTING SOLDER OVERFLOW
#6Package comprising chip contact element of two different electrically conductive materials
#7EMI shielding structure in InFO package