H01L2224/73211 - CPC Classification Index

ClassID:

210148 ⎘

H01L2224/73211 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being of different types provided for in two or more of groups; Location after the connecting process on the same surface Bump and TAB connectors

Recent Application in this class:

20210296280

2021-09-23

STACKED MODULE PACKAGE INTERCONNECT STRUCTURE WITH FLEX CABLE

20190051605

2019-02-14

High-density interconnecting adhesive tape

20190051603

2019-02-14

High-density interconnecting adhesive tape

20150187731

2015-07-02

LOW COST CONNECTOR FOR HIGH SPEED, HIGH DENSITY SIGNAL DELIVERY