210149 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being of different types provided for in two or more of groups; Location after the connecting process on the same surface Layer and strap connectors
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED METHODS
#2SEMICONDUCTOR PACKAGE
#3ELECTRONIC MODULE
#4SEMICONDUCTOR DEVICE
#5FLIP CHIP AND PRE-MOLDED CLIP POWER MODULES
#6SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED METHODS
#7SEMICONDUCTOR DEVICE
#8SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE
#9PACKAGE DEVICE PREVENTING SOLDER OVERFLOW
#10SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
#11POWER MODULE AND METHOD FOR MANUFACTURING SAME
#12Method for Producing Power Semiconductor Module and Power Semiconductor Module
#13CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#14Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each other
#15SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SHAPED METAL BODY THAT IS ELECTRICALLY CONTACTED BY THE SEMICONDUCTOR
#16Method for processing a semiconductor wafer, semiconductor wafer, clip and semiconductor device
#17Plurality of heat sinks for a semiconductor package
#18Semiconductor packages using package in package systems and related methods
#19Semiconductor device
#20Electronic module
#21Integrated spring mounted chip termination
#22Integrated circuit package with conductive clips
#23Integrated circuit connection arrangement for minimizing crosstalk
#24Assembly and semiconductor device
#25ELECTRONIC DEVICE
#26Integrated circuit connection arrangement for minimizing crosstalk
#27Connection arrangements for integrated lateral diffusion field effect transistors
#28Leadframe and integrated circuit connection arrangement
#29Method for die and clip attachment
#30Electronic device
#31Power module
#32Semiconductor device having compliant and crack-arresting interconnect structure
#33Sintered conductive matrix material on wire bond
#34Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
#35Power semiconductor device
#36SEMICONDUCTOR PACKAGE APPARATUS
#37Flip chip assembly and process with sintering material on metal bumps
#38Module comprising a semiconductor chip
#39Array based fabrication of power semiconductor package with integrated heat spreader
#40Power semiconductor module
#41Electric device package comprising a laminate and method of making an electric device package comprising a laminate
#42Power semiconductor module and method of manufacturing the same
#43Flip chip assembly and process with sintering material on metal bumps
#44Module comprising a semiconductor chip
#45WIRE BONDING FOR INTERCONNECTION BETWEEN INTERPOSER AND FLIP CHIP DIE
#46Module comprising a semiconductor chip
#47Microelectronic connection component
#48Semiconductor device having compliant and crack-arresting interconnect structure