H01L2224/73219 - CPC Classification Index

ClassID:

210152 ⎘

H01L2224/73219 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being of different types provided for in two or more of groups; Location after the connecting process on the same surface Layer and TAB connectors

Recent Application in this class:

20210193612

2021-06-24

Method for manufacturing mounting structure for electronic component, mounting structure for electronic component, electronic module, and wiring sheet

20180151536

2018-05-31

Chip-on film and display device including the same

20160365295

2016-12-15

Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement

20160099227

2016-04-07

Discrete flexible interconnects for modules of integrated circuits

20150221617

2015-08-06

Multiple die face-down stacking for two or more die

20140103512

2014-04-17

Dual-leadframe multi-chip package

20130147064

2013-06-13

Semiconductor device having a chip mounting portion on which a separated plated layer is disposed

20130140673

2013-06-06

Monolithic semiconductor switches and method for manufacturing

20130127062

2013-05-23

Multiple die face-down stacking for two or more die

#10

20130069211

2013-03-21

Device including a semiconductor chip and metal foils

#11

20130009300

2013-01-10

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

#12

20130005083

2013-01-03

Four MOSFET full bridge module

#13

20120267682

2012-10-25

Semiconductor device

#14

20120264257

2012-10-18

MOLD ARRAY PROCESS METHOD TO PREVENT EXPOSURE OF SUBSTRATE PERIPHERIES

#15

20120261825

2012-10-18

Semiconductor device

#16

20120199989

2012-08-09

CIRCUIT ARRANGEMENT AND MANUFACTURING METHOD THEREOF

#17

20120193695

2012-08-02

Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors

#18

20120161304

2012-06-28

Dual-leadframe multi-chip package and method of manufacture

#19

20120149149

2012-06-14

FOUR MOSFET FULL BRIDGE MODULE

#20

20120034742

2012-02-09

SEMICONDUCTOR DEVICE

#21

20120032317

2012-02-09

Self-aligning structures and method for integrated chips

#22

20120001342

2012-01-05

Internal packaging of a semiconductor device mounted on die pads

#23

20110316135

2011-12-29

Semiconductor device attached to island having protrusion

#24

20110291286

2011-12-01

Electronic device and method for connecting a die to a connection terminal

#25

20110241170

2011-10-06

Monolithic semiconductor switches and method for manufacturing

#26

20110237031

2011-09-29

Semiconductor device and manufacturing method of the same

#27

20110233746

2011-09-29

Dual-leadframe multi-chip package and method of manufacture

#28

20110210708

2011-09-01

High Frequency Power Supply Module Having High Efficiency and High Current

#29

20110186981

2011-08-04

Semiconductor device with surface electrodes

#30

20110163432

2011-07-07

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#31

20110163431

2011-07-07

Semiconductor device and method of manufacturing the same

#32

20110163392

2011-07-07

Semiconductor device and method of manufacturing the same

#33

20110156274

2011-06-30

SEMICONDUCTOR DEVICE

#34

20110115062

2011-05-19

Semiconductor device and method of manufacturing the same

#35

20110108968

2011-05-12

Semiconductor package with metal straps

#36

20110073921

2011-03-31

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

#37

20110024884

2011-02-03

Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors

#38

20100308457

2010-12-09

Semiconductor apparatus and manufacturing method of the same

#39

20100289127

2010-11-18

Semiconductor device

#40

20100270992

2010-10-28

SEMICONDUCTOR DEVICE

#41

20100258945

2010-10-14

Semiconductor device and method for manufacturing the same

#42

20100187605

2010-07-29

Monolithic semiconductor switches and method for manufacturing

#43

20100171543

2010-07-08

PACKAGED POWER SWITCHING DEVICE

#44

20100133666

2010-06-03

Device including a semiconductor chip and metal foils

#45

20100129962

2010-05-27

Electronic package structure and method

#46

20100124801

2010-05-20

ELECTRONIC PACKAGE STRUCTURE AND METHOD

#47

20100123255

2010-05-20

Electronic package structure having conductive strip and method

#48

20100123240

2010-05-20

Semiconductor device and manufacturing method thereof

#49

20100105174

2010-04-29

SEMICONDUCTOR DEVICE

#50

20100059875

2010-03-11

Semiconductor device

#51

20100032816

2010-02-11

Electronic device and method of manufacturing same

#52

20090315175

2009-12-24

Electrode structure and semiconductor device

#53

20090298232

2009-12-03

Method of forming a leaded molded array package

#54

20090294936

2009-12-03

Four mosfet full bridge module

#55

20090294934

2009-12-03

Conductive clip for semiconductor device package

#56

20090244868

2009-10-01

Semiconductor device and bonding material

#57

20090236708

2009-09-24

Semiconductor package having a bridged plate interconnection

#58

20090230519

2009-09-17

Semiconductor Device

#59

20090218676

2009-09-03

SEMICONDUCTOR DEVICE

#60

20090209065

2009-08-20

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ULTRASONIC BONDING APPARATUS

#61

20090189264

2009-07-30

Semiconductor device and manufacturing method of the same

#62

20090189259

2009-07-30

Method of manufacturing electronic device on leadframe

#63

20090166839

2009-07-02

SEMICONDUCTOR STACK DEVICE AND MOUNTING METHOD

#64

20090152697

2009-06-18

Semiconductor device and manufacturing method of the same

#65

20090127691

2009-05-21

Semiconductor power module packages with simplified structure and methods of fabricating the same

#66

20090121331

2009-05-14

Self-aligning structures and method for integrated circuits

#67

20090121330

2009-05-14

Clip mount for integrated circuit leadframes

#68

20090108467

2009-04-30

Device with a plurality of semiconductor chips

#69

20090072390

2009-03-19

SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF

#70

20090016088

2009-01-15

Semiconductor assembly

#71

20080265386

2008-10-30

Semiconductor device

#72

20080246137

2008-10-09

Integrated circuit device and method for the production thereof

#73

20080224323

2008-09-18

Semiconductor module with multiple semiconductor chips

#74

20080197507

2008-08-21

Electronic package structure and method

#75

20080197463

2008-08-21

Electronic component and method for manufacturing an electronic component

#76

20080150102

2008-06-26

Semiconductor device with lead frame including conductor plates arranged three-dimensionally

#77

20080122063

2008-05-29

Semiconductor device

#78

20080093736

2008-04-24

SEMICONDUCTOR DEVICE

#79

20080087992

2008-04-17

Semiconductor package having a bridged plate interconnection

#80

20080054422

2008-03-06

Semiconductor device

#81

20080006923

2008-01-10

Electronic module with switching functions and method for producing the same

#82

20070267727

2007-11-22

Copper straps

#83

20070215999

2007-09-20

Semiconductor device

#84

20070176266

2007-08-02

Semiconductor device

#85

20070164423

2007-07-19

Semiconductor package

#86

20070138610

2007-06-21

Semiconductor package structure and method of manufacture

#87

20070114676

2007-05-24

Semiconductor package structure and method of manufacture

#88

20070114577

2007-05-24

SEMICONDUCTOR DEVICE

#89

20070111393

2007-05-17

Method of forming a leaded molded array package

#90

20070035019

2007-02-15

Semiconductor component and method of manufacture

#91

20060244116

2006-11-02

Semiconductor device having a flexible board for connection to a semiconductor chip mounted on an insulating substrate

#92

20060128067

2006-06-15

Semiconductor device package

#93

20060055011

2006-03-16

Robust power semiconductor package

#94

20050161785

2005-07-28

Semiconductor device