H01L2224/7515 - CPC Classification Index

ClassID:

210189 ⎘

H01L2224/7515 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors Means for applying permanent coating, e.g. in-situ coating

Sub-classes:

H01L2224/75151 » Means for direct writing 1
H01L2224/75161 » Means for screen printing, e.g. roller, squeegee, screen stencil 1
H01L2224/7517 » Means for applying a preform, e.g. laminator 2
H01L2224/7518 » Means for blanket deposition 2

Recent Application in this class:

20200343216

Bonding apparatus, bonding system, bonding method and storage medium

20190385973

Bonding apparatus, bonding system, bonding method and storage medium

20180158796

Bonding apparatus, bonding system, bonding method and storage medium

20170320155

Method for forming solder deposits

20150059985

Bonding system

20140246481

Bonding structure manufacturing method, heating and melting treatment method, and system therefor

20140096379

Electronic component mounting method

20120100668

Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method

20110287560

Method for device packaging

20100314433

Method for manufacturing tight pitch, flip chip integrated circuit packages

20090251701

Mounting apparatus, inspecting apparatus, inspecting method, and mounting method

20080150135

Mounting method for semiconductor parts on circuit substrate

20070137559

Paste coater and PoP automatic mounting apparatus employing the same

20050098610

Apparatus and method for mounting electronic components

20050067468

Fluxes for flip chip assembly using water soluble polymers

20050057856

Head assembly, disk unit, and bonding method and apparatus