ClassID:

210193

H01L2224/75155 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for applying permanent coating, e.g. in-situ coating; Means for direct writing Jetting means, e.g. ink jet

Recent Application in this class: