ClassID:

210197

H01L2224/75171 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for applying permanent coating, e.g. in-situ coating; Means for applying a preform, e.g. laminator including a vacuum-bag