210201 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for applying permanent coating, e.g. in-situ coating; Means for blanket deposition for immersion coating, i.e. bath
DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
#2SEMICONDUCTOR DIE DIPPING STRUCTURE
#3Pick-and-place tool for packaging process
#4Methods and apparatus for alignment in flip chip bonding