ClassID:

210203

H01L2224/75185 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for applying permanent coating, e.g. in-situ coating; Means for blanket deposition Means for physical vapour deposition [PVD], e.g. evaporation, sputtering