Patents-Review.com
ClassID:

210236 ⎘

H01L2224/75343 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations

Sub-classes:
Recent Application in this class:
#1
20240021570
2024-01-18

BONDING APPARATUS

 #2
20220310553
2022-09-29

BONDING AND INDEXING METHOD

 #3
20210134756
2021-05-06

Bonding apparatus and method for using the same

 #4
20200273759
2020-08-27

Systems and methods for bonding semiconductor elements

 #5
20190348393
2019-11-14

Bonding apparatus

 #6
20190267265
2019-08-29

Method and apparatus for embedding semiconductor devices

 #7
20190206829
2019-07-04

Bonding and indexing apparatus

 #8
20190198476
2019-06-27

Bonding apparatus and method for using the same

 #9
20180236613
2018-08-23

Mounting Method of a semiconductor device using a colored auxiliary joining agent

 #10
20180182733
2018-06-28

Systems and methods for bonding semiconductor elements

 #11
20180169803
2018-06-21

Methods and systems for aligning tooling elements of ultrasonic bonding systems

 #12
20180090395
2018-03-29

Systems and methods for bonding semiconductor elements

 #13
20180076168
2018-03-15

Fluidic Self Assembly of Contact Materials

 #14
20180026006
2018-01-25

Systems and methods for bonding semiconductor elements

 #15
20170186724
2017-06-29

Systems and methods for bonding semiconductor elements

 #16
20170144246
2017-05-25

Apparatus for the material-bonded connection of connection partners of a power-electronics component

 #17
20170053892
2017-02-23

Device and method for permanent bonding

 #18
20160297037
2016-10-13

Methods and systems for aligning tooling elements of ultrasonic bonding systems

 #19
20160254252
2016-09-01

Systems and methods for bonding semiconductor elements

 #20
20160225735
2016-08-04

Method for producing a connecting medium on an assembly partner, method for producing a material-fit connection between an assembly partner and a metal layer, and a system for carrying out the methods

 #21
20160148819
2016-05-26

Method for producing a material-bonding connection between a semiconductor chip and a metal layer

 #22
20150348951
2015-12-03

Systems and methods for bonding semiconductor elements

 #23
20150306701
2015-10-29

METHOD AND APPARATUS FOR CONNECTING CONNECTION ELEMENTS TO THE SUBSTRATE OF A POWER SEMICONDUCTOR MODULE BY WELDING

 #24
20150303236
2015-10-22

Flip-chip bonding method and solid-state image pickup device manufacturing method characterized in including flip-chip bonding method

 #25
20150235984
2015-08-20

Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus

 #26
20150228529
2015-08-13

Clamping mechanism for processing of a substrate within a substrate carrier

 #27
20130228611
2013-09-05

Methods and systems for aligning tooling elements of ultrasonic bonding systems

 #28
20110272802
2011-11-10

Bump, method for forming the bump, and method for mounting substrate having the bump thereon

 #29
20060091185
2006-05-04

Method of mounting electronic component

 #30
20050277244
2005-12-15

Method for fastening microtool components to objects

 #31
15054907
2017-07-11

Semiconductor manufacturing method and associated semiconductor manufacturing system