210240 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations Ultrasonic horns
CIRCUIT BOARD AND MANUFACTURING METHOD
#2CIRCUIT BOARD AND MANUFACTURING METHOD
#3BONDING APPARATUS AND BONDING METHOD USING THE SAME
#4Ultrasonic-assisted solder transfer
#5Mounting Method of a semiconductor device using a colored auxiliary joining agent
#6Connecting device and circuit chip connecting method using connecting device
#7Ultrasonic welding head
#8Mounting machine and controller for the mounting machine