H01L2224/756 - CPC Classification Index

ClassID:

210245 ⎘

H01L2224/756 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors Means for supplying the connector to be connected in the bonding apparatus

Sub-classes:

H01L2224/75601 » Storing means 6
H01L2224/75611 » Feeding means 43
H01L2224/75621 » Holding means 20

Recent Application in this class:

20210280436

Method of applying conductive adhesive and manufacturing device using the same

20200144219

Apparatus for mounting conductive ball

20200144077

Method of applying conductive adhesive and manufacturing device using the same

20200051953

Bonding method of semiconductor chip and bonding apparatus of semiconductor chip

20180158757

Method for electrically contacting a component by galvanic connection of an open-pored contact piece, and corresponding component module

20170309594

Bonding method of semiconductor chip and bonding apparatus of semiconductor chip

20160214364

Member bonding apparatus and method

20160126218

Bonding method of semiconductor chip and bonding apparatus of semiconductor chip

20150222071

Component mounting method

20140196853

Method for detaching a semiconductor chip from a foil

20080188058

Semiconductor device and manufacturing method thereof