Patents-Review.com
ClassID:

210247 ⎘

H01L2224/75611 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for supplying the connector to be connected in the bonding apparatus Feeding means

Recent Application in this class:
#1
20260026386
2026-01-22

UNDERFILL DISPENSING SYSTEM

 #2
20250140738
2025-05-01

SEMICONDUCTOR MANUFACTURING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS, AND SEMICONDUCTOR APPARATUS

 #3
20250096189
2025-03-20

BALL MOUNTING APPARATUS WITH BALL ATTACH VOLUME CONTROL

 #4
20240038716
2024-02-01

SYSTEM AND METHOD FOR DEPOSITING UNDERFILL MATERIAL

 #5
20230420406
2023-12-28

INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF

 #6
20230260950
2023-08-17

Underfill Dams

 #7
20230011327
2023-01-12

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

 #8
20220415845
2022-12-29

Mounting apparatus

 #9
20220068874
2022-03-03

Method of manufacturing a semiconductor package and apparatus for performing the same

 #10
20210249378
2021-08-12

Ball disposition system, method of disposing a ball on a substrate and method of manufacturing semiconductor device

 #11
20200286748
2020-09-10

Lid attach process and dispenser head

 #12
20200144220
2020-05-07

Method of mounting conductive ball

 #13
20190067243
2019-02-28

Apparatus and method for manufacturing plurality of electronic circuits

 #14
20190059160
2019-02-21

Electronic Device and Method of Making the Same Using Surface Mount Technology

 #15
20190054491
2019-02-21

Metering apparatus

 #16
20180342479
2018-11-29

Substrate processing apparatus and manufacturing method of substrate holding unit

 #17
20180308713
2018-10-25

Systems and methods for improved delamination characteristics in a semiconductor package

 #18
20180130683
2018-05-10

Apparatus and method for contactless transfer and soldering of chips using a flash lamp

 #19
20180019223
2018-01-18

Mounting device and mounting method

 #20
20170347504
2017-11-30

Electronic-component mounting apparatus

 #21
20170076960
2017-03-16

Lid attach processes for semiconductor packages

 #22
20160351533
2016-12-01

Method for producing an integral join and automatic placement machine

 #23
20160086830
2016-03-24

Die bonding tool and system

 #24
20160081241
2016-03-17

Electronic-component mounting apparatus

 #25
20150228622
2015-08-13

Chip support substrate, chip support method, three-dimensional integrated circuit, assembly device, and fabrication method of three-dimensional integrated circuit

 #26
20150228613
2015-08-13

Apparatus and Method for Placing and Mounting Solder Balls on an Integrated Circuit Substrate

 #27
20150121692
2015-05-07

Electric component mounting method

 #28
20150069089
2015-03-12

Lid attach process and apparatus for fabrication of semiconductor packages

 #29
20140096379
2014-04-10

Electronic component mounting method

 #30
20130313745
2013-11-28

Application method of liquid material, application device and program

 #31
20130267062
2013-10-10

Dispensing Tool

 #32
20130260511
2013-10-03

Lid attach process and apparatus for fabrication of semiconductor packages

 #33
20130016205
2013-01-17

Die bonder

 #34
20130014881
2013-01-17

Biaxial Drive Mechanism, Die Bonder and Die Bonder Operating Method

 #35
20120240658
2012-09-27

Method and apparatus for calibrating dispensed deposits

 #36
20120098113
2012-04-26

Device with semiconductor die attached to a leadframe

 #37
20110289772
2011-12-01

Component mounting apparatus and method

 #38
20110068483
2011-03-24

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

 #39
20100314433
2010-12-16

Method for manufacturing tight pitch, flip chip integrated circuit packages

 #40
20100255641
2010-10-07

Semiconductor Manufacturing Method

 #41
20100242268
2010-09-30

Electronic parts mounting device

 #42
20090146279
2009-06-11

Method for attaching a semiconductor die to a leadframe, and a semiconductor device

 #43
20080142576
2008-06-19

Method for the production of a soldered joint

 #44
20060151889
2006-07-13

Semiconductor apparatus and manufacturing method

 #45
20050095367
2005-05-05

Method of noncontact dispensing of viscous material