Patents-Review.com
ClassID:

210259 ⎘

H01L2224/75704 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for aligning; Mechanical holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck

Recent Application in this class:
#1
20250309185
2025-10-02

SOLDER REFLOW APPARATUS

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20250226243
2025-07-10

METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTURING DISPLAY DEVICE

 #3
20240128229
2024-04-18

SOLDER REFLOW APPARATUS

 #4
20230178391
2023-06-08

Method for manufacturing display device and apparatus for manufacturing display device

 #5
20220077103
2022-03-10

Semiconductor device having through parts of different shapes

 #6
20220052019
2022-02-17

System for laser bonding of flip chip

 #7
20210398938
2021-12-23

Uniform pressure gang bonding method

 #8
20210272928
2021-09-02

Apparatus for bond wave propagation control

 #9
20200194401
2020-06-18

System and method for uniform pressure gang bonding

 #10
20200051950
2020-02-13

Apparatus for bond wave propagation control

 #11
20190355146
2019-11-21

Method for securing a bonding product in a working region of a bonder

 #12
20190267265
2019-08-29

Method and apparatus for embedding semiconductor devices

 #13
20190096848
2019-03-28

Apparatus for bond wave propagation control

 #14
20190027462
2019-01-24

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

 #15
20180138070
2018-05-17

Positioning device

 #16
20180096962
2018-04-05

SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO

 #17
20170287771
2017-10-05

Stretching retention plate for electronic assemblies

 #18
20170229418
2017-08-10

Sintering device

 #19
20170221856
2017-08-03

Method for bonding substrates together, and substrate bonding device

 #20
20170186679
2017-06-29

Semiconductor device package and manufacturing method thereof

 #21
20170144246
2017-05-25

Apparatus for the material-bonded connection of connection partners of a power-electronics component

 #22
20160358881
2016-12-08

Method for bonding substrates

 #23
20160155721
2016-06-02

Bonding method, storage medium, bonding apparatus and bonding system

 #24
20160118362
2016-04-28

Bonding apparatus and substrate manufacturing equipment including the same

 #25
20150371888
2015-12-24

Universal clamping fixture to maintain laminate flatness during chip join

 #26
20150371887
2015-12-24

Universal clamping fixture to maintain laminate flatness during chip join

 #27
20150228529
2015-08-13

Clamping mechanism for processing of a substrate within a substrate carrier

 #28
20150063969
2015-03-05

Method and apparatus for dynamic alignment of semiconductor devices

 #29
20150061099
2015-03-05

Dense-pitch small-pad copper wire bonded double IC chip stack packaging piece and preparation method therefor

 #30
20140295618
2014-10-02

Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding

 #31
20130102112
2013-04-25

Process for forming packages

 #32
20120292375
2012-11-22

METHOD OF JOINING A CHIP ON A SUBSTRATE

 #33
20120247664
2012-10-04

Bonding apparatus and bonding method

 #34
20120211878
2012-08-23

Chip package with plank stack of semiconductor dies

 #35
20110287560
2011-11-24

Method for device packaging

 #36
20110049221
2011-03-03

Method of joining a chip on a substrate

 #37
20090134205
2009-05-28

Soldering Method, Method for Manufacturing Semiconductor Module, and Soldering Apparatus

 #38
20080199986
2008-08-21

Method and apparatus for manufacturing electronic integrated circuit chip

 #39
20080176361
2008-07-24

Manufacturing method of electronic device