H01L2224/757 - CPC Classification Index

ClassID:

210255 ⎘

H01L2224/757 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors Means for aligning

Sub-classes:

H01L2224/75701 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 38
H01L2224/75702 » in the upper part of the bonding apparatus, e.g. in the bonding head 79
H01L2224/75703 » Mechanical holding means 23
H01L2224/75723 » Electrostatic holding means 4
H01L2224/75733 » Magnetic holding means 9
H01L2224/75743 » Suction holding means 79
H01L2224/75753 » Means for optical alignment, e.g. sensors 182
H01L2224/75754 » Guiding structures 31

Recent Application in this class:

20250309189

2025-10-02

BONDING WITH PRE-DEOXIDE PROCESS AND APPARATUS FOR PERFORMING THE SAME

20220352412

2022-11-03

Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating

20220285310

2022-09-08

Bonding with Pre-Deoxide Process and Apparatus for Performing the Same

20220122939

2022-04-21

Producing apparatus

20210013079

2021-01-14

Apparatus, system, and method for handling aligned wafer pairs

20190333798

2019-10-31

Alignment mechanism, chuck device, and bonder

20190326251

2019-10-24

Bonding with pre-deoxide process and apparatus for performing the same

20180082969

2018-03-22

Chip alignment utilizing superomniphobic surface treatment of silicon die

20170372925

2017-12-28

System and related techniques for handling aligned substrate pairs

#10

20170278817

2017-09-28

Chip alignment utilizing superomniphobic surface treatment of silicon die

#11

20170221856

2017-08-03

Method for bonding substrates together, and substrate bonding device

#12

20170053823

2017-02-23

Bond chuck, methods of bonding, and tool including bond chuck

#13

20160374211

2016-12-22

Method and apparatus for assembling a component with a flexible foil, as well as the assembled product

#14

20160336212

2016-11-17

Apparatus, system, and method for handling aligned wafer pairs

#15

20160172324

2016-06-16

Alignment of three dimensional integrated circuit components

#16

20160172252

2016-06-16

Alignment of three dimensional integrated circuit components

#17

20160084638

2016-03-24

Pressure application apparatus and pressure application method

#18

20150303082

2015-10-22

Pressure transmitting device for bonding chips onto a substrate

#19

20150201537

2015-07-16

Chip attach frame

#20

20150069115

2015-03-12

Device and method for bonding substrates

#21

20140342504

2014-11-20

Method of manufacturing an electronic device, and electronic device manufacturing apparatus

#22

20140263583

2014-09-18

Two-step direct bonding processes and tools for performing the same

#23

20140256087

2014-09-11

Hybrid bonding and apparatus for performing the same

#24

20140151437

2014-06-05

Apparatus for mounting semiconductor chips on a circuit board

#25

20130320529

2013-12-05

Reactive bonding of a flip chip package

#26

20130292454

2013-11-07

Apparatus and method for determining an alignment of a bondhead of a die bonder relative to a workchuck

#27

20130207250

2013-08-15

Chip attach frame

#28

20130140713

2013-06-06

Interposer wafer bonding method and apparatus

#29

20130068824

2013-03-21

Die bonder and bonding method

#30

20120127485

2012-05-24

Pressure application apparatus and pressure application method

#31

20120119343

2012-05-17

Stacked leadframe implementation for DC/DC convertor power module incorporating a stacked controller and stacked leadframe construction methodology

#32

20120091187

2012-04-19

Bonding apparatus and bonding method

#33

20120091186

2012-04-19

Bonding apparatus

#34

20120015457

2012-01-19

PCB-mounted integrated circuits

#35

20110287560

2011-11-24

Method for device packaging

#36

20110049702

2011-03-03

SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME

#37

20110045653

2011-02-24

Bonding method and bonding apparatus

#38

20110006431

2011-01-13

Method for aligning and bonding elements and a device comprising aligned and bonded elements

#39

20100006621

2010-01-14

Ultrasonic bonding apparatus

#40

20100006231

2010-01-14

Ultrasonic bonding apparatus

#41

20090127315

2009-05-21

APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

#42

20090090468

2009-04-09

FLIP-CHIP MOUNTING APPARATUS

#43

20080308952

2008-12-18

Method for Reliably Positioning Solder on a Die Pad for Attaching a Semiconductor Chip to the Die Pad and Molding Die for Solder Dispensing Apparatus

#44

20080251946

2008-10-16

Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus

#45

20080157405

2008-07-03

CHIP STACK WITH PRECISION ALIGNMENT, HIGH YIELD ASSEMBLY AND THERMAL CONDUCTIVITY

#46

20080153201

2008-06-26

Flip chip mounting method by no-flow underfill having level control function

#47

20070181653

2007-08-09

Magnetic alignment of integrated circuits to each other

#48

20070152328

2007-07-05

Methods including fluxless chip attach processes

#49

20070145102

2007-06-28

Method for mounting a flip chip on a substrate

#50

20050218513

2005-10-06

Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus