H01L2224/75723 - CPC Classification Index

ClassID:

210261 ⎘

H01L2224/75723 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for aligning Electrostatic holding means

Sub-classes:

H01L2224/75724 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 18
H01L2224/75725 » in the upper part of the bonding apparatus, e.g. in the bonding head 38

Recent Application in this class:

20200279826

2020-09-03

Assembly apparatus for assembling semiconductor light emitting diode to display panel

20160176045

2016-06-23

Mass transfer tool manipulator assembly

20150228622

2015-08-13

Chip support substrate, chip support method, three-dimensional integrated circuit, assembly device, and fabrication method of three-dimensional integrated circuit

20130168708

2013-07-04

Method for disposing fine objects, apparatus for arranging fine objects, illuminating apparatus and display apparatus