H01L2224/75733 - CPC Classification Index

ClassID:

210264 ⎘

H01L2224/75733 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for aligning Magnetic holding means

Sub-classes:

H01L2224/75734 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 9
H01L2224/75735 » in the upper part of the bonding apparatus, e.g. in the bonding head 9

Recent Application in this class:

20220076980

Substrate bonding apparatus and method of manufacturing a semiconductor device

20210005490

Adsorption device, transferring system having same, and transferring method using same

20160111408

Light emitting diodes and a method of packaging the same

20150050761

Light emitting diodes and a method of packaging the same

20140091509

Methods for forming 3DIC package

20130095608

Methods for forming 3DIC package

20090020229

Semiconductor chip bonding apparatus

20080121724

Semiconductor chips for TAG applications, devices for mounting the same, and mounting method

20060131712

Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component