H01L2224/75743 - CPC Classification Index

ClassID:

210267 ⎘

H01L2224/75743 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for aligning Suction holding means

Sub-classes:

H01L2224/75744 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 107
H01L2224/75745 » in the upper part of the bonding apparatus, e.g. in the bonding head 223

Recent Application in this class:

20230054378

2023-02-23

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

20210280436

2021-09-09

Method of applying conductive adhesive and manufacturing device using the same

20210082867

2021-03-18

Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

20210013079

2021-01-14

Apparatus, system, and method for handling aligned wafer pairs

20200291548

2020-09-17

PTFE sheet and method for mounting die

20200144077

2020-05-07

Method of applying conductive adhesive and manufacturing device using the same

20200051953

2020-02-13

Bonding method of semiconductor chip and bonding apparatus of semiconductor chip

20190333798

2019-10-31

Alignment mechanism, chuck device, and bonder

20190081002

2019-03-14

Semiconductor packages with embedded bridge interconnects

#10

20180019226

2018-01-18

Bonding system

#11

20180019225

2018-01-18

Bonding systems

#12

20170372925

2017-12-28

System and related techniques for handling aligned substrate pairs

#13

20170309594

2017-10-26

Bonding method of semiconductor chip and bonding apparatus of semiconductor chip

#14

20170271264

2017-09-21

Semiconductor packages with embedded bridge interconnects

#15

20160336212

2016-11-17

Apparatus, system, and method for handling aligned wafer pairs

#16

20160126218

2016-05-05

Bonding method of semiconductor chip and bonding apparatus of semiconductor chip

#17

20160056124

2016-02-25

Method of manufacturing semiconductor device

#18

20150228624

2015-08-13

Semiconductor device and method of manufacturing the same

#19

20150171048

2015-06-18

Bonding device

#20

20140209666

2014-07-31

3D assembly for interposer bow

#21

20140127860

2014-05-08

Method of manufacturing semiconductor device

#22

20130140713

2013-06-06

Interposer wafer bonding method and apparatus

#23

20130005086

2013-01-03

Method of manufacturing semiconductor device

#24

20120322202

2012-12-20

Manufacturing method including deformation of supporting board to accommodate semiconductor device

#25

20120043005

2012-02-23

Electronic packaging apparatus and electronic packaging method

#26

20110171777

2011-07-14

Method of manufacturing semiconductor device

#27

20110084384

2011-04-14

Semiconductor device and method for manufacturing the same

#28

20110074029

2011-03-31

Flip-chip package covered with tape

#29

20110039375

2011-02-17

Method of manufacturing semiconductor device

#30

20100289159

2010-11-18

Semiconductor die collet

#31

20100148368

2010-06-17

Semiconductor device

#32

20100132187

2010-06-03

Part mounting method

#33

20100064510

2010-03-18

COMPONENT SUPPLY HEAD DEVICE AND COMPONENT MOUNTING HEAD DEVICE

#34

20090309239

2009-12-17

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE

#35

20090288767

2009-11-26

Electronic component mounting method

#36

20090265924

2009-10-29

Electronic component mounting head, and apparatus and method for mounting electronic component

#37

20090251701

2009-10-08

Mounting apparatus, inspecting apparatus, inspecting method, and mounting method

#38

20090203170

2009-08-13

Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body

#39

20090186451

2009-07-23

Manufacturing method of semiconductor device

#40

20090145546

2009-06-11

Electrode bonding method and part mounting apparatus

#41

20090139085

2009-06-04

Methods for manufacturing semiconductor devices

#42

20090039531

2009-02-12

Flip-chip package covered with tape

#43

20090035891

2009-02-05

Method and apparatus for flip-chip bonding

#44

20090032296

2009-02-05

Method of manufacturing a contact arrangement between a microelectronic component and a carrier

#45

20090029488

2009-01-29

Soldering method for mounting semiconductor device on wiring board to ensure invariable gap therebetween, and soldering apparatus therefor

#46

20090020874

2009-01-22

Semiconductor device and method for manufacturing semiconductor device

#47

20090014874

2009-01-15

Semiconductor package with reduced length interconnect and manufacturing method thereof

#48

20080268571

2008-10-30

Flip chip laser bonding process

#49

20080233680

2008-09-25

Semiconductor die collet and method

#50

20080224325

2008-09-18

Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board

#51

20080211095

2008-09-04

Semiconductor device and manufacturing method of the semiconductor device

#52

20080196245

2008-08-21

Method for mounting electronic components

#53

20080188058

2008-08-07

Semiconductor device and manufacturing method thereof

#54

20080179738

2008-07-31

Wiring board and semiconductor device

#55

20080174004

2008-07-24

Semiconductor device using wiring substrate having a wiring structure reducing wiring disconnection

#56

20080173383

2008-07-24

Method and apparatus for manufacturing electronic device

#57

20080142949

2008-06-19

Semiconductor assembly for improved device warpage and solder ball coplanarity

#58

20080042300

2008-02-21

Circuit substrate and semiconductor device

#59

20080040917

2008-02-21

Component supply head device and component mounting head device

#60

20070231961

2007-10-04

Semiconductor device manufacturing method

#61

20070212814

2007-09-13

Method for manufacturing semiconductor device

#62

20070187457

2007-08-16

Component mounting method, component mounting apparatus, and ultrasonic bonding head

#63

20070181644

2007-08-09

Component mounting method and component mounting apparatus

#64

20070124928

2007-06-07

CIRCUIT SUBSTRATES, SEMICONDUCTOR DEVICES, SEMICONDUCTOR MANUFACTURING APPARATUSES, METHODS FOR MANUFACTURING CIRCUIT SUBSTRATES, AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES

#65

20070099412

2007-05-03

Soldering method for mounting semiconductor device on wiring board to ensure invariable gap therebetween, and soldering apparatus therefor

#66

20070085171

2007-04-19

Semiconductor assembly for improved device warpage and solder ball coplanarity

#67

20070037318

2007-02-15

Method and apparatus for flip-chip bonding

#68

20070020801

2007-01-25

IC chip mounting method for mounting two or more IC chips by sequentially transferring the IC chips sucked onto a first roller to a second roller and mounting the IC chips transferred to the second roller on a traveling base

#69