Patents-Review.com
ClassID:

210280 ⎘

H01L2224/75822 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for moving parts; Upper part of the bonding apparatus, i.e. bonding head Rotational mechanism

Sub-classes:
Recent Application in this class:
#1
20230011327
2023-01-12

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

 #2
20200144218
2020-05-07

Chip bonding apparatus and bonding method

 #3
20200035521
2020-01-30

Component handling device for removing components from a structured supply

 #4
20190385972
2019-12-19

Batch bonding apparatus and bonding method

 #5
20190378811
2019-12-12

Vertically die-stacked bonder and method using the same

 #6
20190333798
2019-10-31

Alignment mechanism, chuck device, and bonder

 #7
20190189587
2019-06-20

Bonding device

 #8
20190006211
2019-01-03

Electronic component handling unit

 #9
20180323165
2018-11-08

Vertically die-stacked bonder and method using the same

 #10
20180315628
2018-11-01

Receiving system for components

 #11
20180308727
2018-10-25

Component handling system

 #12
20180303015
2018-10-18

Device and method for self-adjustment of a component-handling device for electronic components

 #13
20180236613
2018-08-23

Mounting Method of a semiconductor device using a colored auxiliary joining agent

 #14
20170347504
2017-11-30

Electronic-component mounting apparatus

 #15
20170140960
2017-05-18

Die mounting system and die mounting method

 #16
20170110433
2017-04-20

Apparatus for removing chip

 #17
20170110432
2017-04-20

Press fitting head and semiconductor manufacturing apparatus using the same

 #18
20160155721
2016-06-02

Bonding method, storage medium, bonding apparatus and bonding system

 #19
20160099225
2016-04-07

Die bonder and bonding method

 #20
20160081241
2016-03-17

Electronic-component mounting apparatus

 #21
20160079200
2016-03-17

Apparatus and method for manufacturing semiconductor device

 #22
20150303082
2015-10-22

Pressure transmitting device for bonding chips onto a substrate

 #23
20150202851
2015-07-23

Substrate composite, method and device for bonding of substrates

 #24
20150044786
2015-02-12

Alignment systems and wafer bonding systems and methods

 #25
20130149817
2013-06-13

FABRICATING METHODS OF SEMICONDUCTOR DEVICES AND PICK-UP APPARATUSES OF SEMICONDUCTOR DEVICES THEREIN

 #26
20130133188
2013-05-30

Apparatus for mounting semiconductor chips

 #27
20130025791
2013-01-31

Method and apparatus for inspecting a semiconductor chip prior to bonding

 #28
20120210554
2012-08-23

APPARATUS AND METHOD FOR PICKING UP AND MOUNTING BARE DIES

 #29
20120104076
2012-05-03

Joining method and device produced by this method and joining unit

 #30
20110287560
2011-11-24

Method for device packaging

 #31
20100252615
2010-10-07

Joining method and device produced by this method and joining unit

 #32
20100043203
2010-02-25

High-speed RFID circuit placement method and device

 #33
20090269882
2009-10-29

Rotary chip attach process

 #34
20090217515
2009-09-03

ELECTRONIC COMPONENT PRODUCTION METHOD AND ELECTRONIC COMPONENT PRODUCTION EQUIPMENT

 #35
20090049687
2009-02-26

Electronic component mounting method and electronic component mounting device

 #36
20090032296
2009-02-05

Method of manufacturing a contact arrangement between a microelectronic component and a carrier

 #37
20080245843
2008-10-09

Joining method and device produced by this method and joining unit

 #38
20080191220
2008-08-14

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

 #39
20070114659
2007-05-24

Rotary chip attach

 #40
20070020801
2007-01-25

IC chip mounting method for mounting two or more IC chips by sequentially transferring the IC chips sucked onto a first roller to a second roller and mounting the IC chips transferred to the second roller on a traveling base

 #41
20060238345
2006-10-26

High-speed RFID circuit placement method and device

 #42
20050214963
2005-09-29

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

 #43
20050095367
2005-05-05

Method of noncontact dispensing of viscous material