H01L2224/761 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with build-up interconnects Means for controlling the bonding environment, e.g. valves, vacuum pumps

• H01L2224/76101 » Chamber 0