H01L2224/76 - CPC Classification
Classification description:
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto Apparatus for connecting with build-up interconnects
Sub-classes:
- H01L2224/76001 » Calibration means 0
- H01L2224/7601 » Means for cleaning, e.g. brushes, for hydro blasting, for ultrasonic cleaning, for dry ice blasting, using gas-flow, by etching, by applying flux or plasma 1
- H01L2224/761 » Means for controlling the bonding environment, e.g. valves, vacuum pumps 0
- H01L2224/7615 » Means for depositing 2
- H01L2224/762 » Protection means against electrical discharge 0
- H01L2224/7625 » Means for applying energy, e.g. heating means 1
- H01L2224/765 » Cooling means 1
- H01L2224/7655 » Mechanical means, e.g. for planarising, pressing, stamping 2
- H01L2224/766 » Means for supplying the material of the interconnect 2
- H01L2224/7665 » Means for transporting the components to be connected 21
- H01L2224/767 » Means for aligning 2
- H01L2224/768 » Means for moving parts 0
- H01L2224/769 » Means for monitoring the connection process 0
- H01L2224/7695 » Means for forming additional members 0
- H01L2224/7698 » specially adapted for batch processes 10
- H01L2224/76981 » Apparatus chuck 3