ClassID:

210363

H01L2224/76554 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with build-up interconnects; Mechanical means, e.g. for planarising, pressing, stamping for abrasive blasting, e.g. sand blasting, wet blasting, hydro-blasting, dry ice blasting