H01L2224/766 - CPC Classification Index

ClassID:

210364 ⎘

H01L2224/766 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with build-up interconnects Means for supplying the material of the interconnect

Sub-classes:

H01L2224/76601 » Storing means 0
H01L2224/76611 » Feeding means 1
H01L2224/76621 » Holding means 1

Recent Application in this class:

20140069697

2014-03-13

Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate

20100248475

2010-09-30

Method of fabricating a semiconductor device