H01L2224/76733 - CPC Classification Index

ClassID:

210383 ⎘

H01L2224/76733 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with build-up interconnects; Means for aligning Magnetic holding means

Sub-classes:

H01L2224/76734 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 0
H01L2224/76735 » in the upper part of the bonding apparatus 1

Recent Application in this class:

20220076980

2022-03-10

Substrate bonding apparatus and method of manufacturing a semiconductor device

20180102352

2018-04-12

Fluid-suspended microcomponent harvest, distribution, and reclamation

20160111408

2016-04-21

Light emitting diodes and a method of packaging the same

20150050761

2015-02-19

Light emitting diodes and a method of packaging the same