ClassID:

210453

H01L2224/77263 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with strap connectors; Means for applying energy, e.g. heating means; Laser in the upper part of the bonding apparatus, e.g. in the wedge