H01L2224/77 - CPC Classification
Classification description:
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto Apparatus for connecting with strap connectors
Sub-classes:
- H01L2224/77001 » Calibration means 0
- H01L2224/7701 » Means for cleaning, e.g. brushes, for hydro blasting, for ultrasonic cleaning, for dry ice blasting, using gas-flow, by etching, by applying flux or plasma 0
- H01L2224/771 » Means for controlling the bonding environment, e.g. valves, vacuum pumps 0
- H01L2224/7715 » Means for applying permanent coating, e.g. in-situ coating 0
- H01L2224/772 » Protection means against electrical discharge 0
- H01L2224/7725 » Means for applying energy, e.g. heating means 0
- H01L2224/775 » Cooling means 0
- H01L2224/7755 » Mechanical means, e.g. for severing, pressing, stamping 3
- H01L2224/776 » Means for supplying the connector to be connected in the bonding apparatus 1
- H01L2224/7765 » Means for transporting the components to be connected 1
- H01L2224/777 » Means for aligning 1
- H01L2224/778 » Means for moving parts 0
- H01L2224/779 » Means for monitoring the connection process 1
- H01L2224/7795 » Means for forming additional members 0
- H01L2224/7798 » specially adapted for batch processes 1
- H01L2224/77981 » Apparatus chuck 0