ClassID:

210514

H01L2224/77802 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with strap connectors; Means for moving parts; Lower part of the bonding apparatus, e.g. XY table Rotational mechanism

Sub-classes: