ClassID:

210517

H01L2224/77821 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with strap connectors; Means for moving parts Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge

Sub-classes:
Recent Application in this class: