ClassID:

210592

H01L2224/78631 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors; Means for supplying the connector to be connected in the bonding apparatus; Holding means, e.g. wire clampers Means for wire tension adjustments

Recent Application in this class: