H01L2224/78703 - CPC Classification Index

ClassID:

210602 ⎘

H01L2224/78703 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors; Means for aligning Mechanical holding means

Sub-classes:

H01L2224/78704 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 15
H01L2224/78705 » in the upper part of the bonding apparatus, e.g. in the capillary or wedge 7

Recent Application in this class:

20190160488

2019-05-30

Electrically conductive pattern printer for downhole tools

20130161806

2013-06-27

Window clamp top plate for integrated circuit packaging

20130019458

2013-01-24

SUPPORT SYSTEM FOR A SEMICONDUCTOR DEVICE

20120274014

2012-11-01

Support structures and clamping systems for semiconductor devices during wire and ribbon bonding operations

20120267772

2012-10-25

Semiconductor device and method of manufacturing the same

20120043650

2012-02-23

Method of packaging an integrated circuit using a laser to remove material from a portion of a lead frame

20120031877

2012-02-09

Gas delivery system for reducing oxidation in wire bonding operations

20120024089

2012-02-02

METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON A WIRE BONDING MACHINE, AND APPARATUSES FOR PERFORMING THE SAME

20110304046

2011-12-15

Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer

#10

20110212572

2011-09-01

Semiconductor device support for bonding

#11

20110163431

2011-07-07

Semiconductor device and method of manufacturing the same

#12

20110101072

2011-05-05

Adjustable clamp system and method for wire bonding die assembly

#13

20110073635

2011-03-31

Gas delivery system for reducing oxidation in wire bonding operations

#14

20110000951

2011-01-06

Wire payout measurement and calibration techniques for a wire bonding machine

#15

20100230476

2010-09-16

REDUCED OXIDATION SYSTEM FOR WIRE BONDING

#16

20100203681

2010-08-12

Method of manufacturing semiconductor device, and wire bonder

#17

20100181628

2010-07-22

SEMICONDUCTOR DEVICE

#18

20100108744

2010-05-06

Closed loop wire bonding methods and bonding force calibration

#19

20100096735

2010-04-22

CLAMPING ASSEMBLY

#20

20090294939

2009-12-03

LEAD FRAME AND SEMICONDUCTOR DEVICE UTILIZING THE SAME

#21

20090134201

2009-05-28

Work clamp and wire bonding apparatus

#22

20080246166

2008-10-09

Semiconductor device and method of manufacturing same

#23

20080230531

2008-09-25

HEAT BLOCK

#24

20080174132

2008-07-24

Soft touch clamp actuation mechanism

#25

20080099531

2008-05-01

Apparatus for delivering shielding gas during wire bonding

#26

20080073408

2008-03-27

MOVABLE ELECTRONIC FLAME-OFF DEVICE FOR A BONDING APPARATUS

#27

20080048006

2008-02-28

WIRE BONDER

#28

20070287222

2007-12-13

Method of fixing curved circuit board and wire bonding apparatus

#29

20070284421

2007-12-13

Device clamp for reducing oxidation in wire bonding

#30

20070251980

2007-11-01

REDUCED OXIDATION SYSTEM FOR WIRE BONDING

#31

20070212821

2007-09-13

Method for manufacturing semiconductor device

#32

20070094867

2007-05-03

Bond Surface Conditioning System for Improved Bondability

#33

20060157532

2006-07-20

Apparatus of clamping semiconductor devices using sliding finger supports

#34

20060154404

2006-07-13

Die paddle clamping method for wire bond enhancement

#35

20050263566

2005-12-01

Substrate holding apparatus

#36

20050199677

2005-09-15

Wire bonding apparatus having actuated flame-off wand

#37

20050194423

2005-09-08

Ultrasonic bonding apparatus and method

#38

20050176178

2005-08-11

Method for manufacturing semiconductor device

#39

20050161488

2005-07-28

System for reducing oxidation of electronic devices

#40

20050067462

2005-03-31

Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate