H01L2224/787 - CPC Classification Index

ClassID:

210599 ⎘

H01L2224/787 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors Means for aligning

Sub-classes:

H01L2224/78701 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 7
H01L2224/78702 » in the upper part of the bonding apparatus, e.g. in the capillary or wedge 5
H01L2224/78703 » Mechanical holding means 40
H01L2224/78723 » Electrostatic holding means 0
H01L2224/78733 » Magnetic holding means 0
H01L2224/78743 » Suction holding means 19
H01L2224/78753 » Means for optical alignment, e.g. sensors 13
H01L2224/78754 » Guiding structures 0

Recent Application in this class:

20180323167

2018-11-08

Methods of operating a wire bonding machine to improve clamping of a substrate, and wire bonding machines

20170005066

2017-01-05

Method of manufacturing a functional inlay