H01L2224/78733 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors; Means for aligning Magnetic holding means

• H01L2224/78734 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 1
• H01L2224/78735 » in the upper part of the bonding apparatus, e.g. in the capillary or wedge 2