210612 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors; Means for aligning; Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
Frame feeder
#2Device and method for positioning first object in relation to second object
#3Methods and apparatus for improved bonding
#4Lead frame support plate and window clamp for wire bonding machines
#5PRESSURE-SENSITIVE ADHESIVE TAPE FOR RESIN ENCAPSULATION AND METHOD FOR PRODUCING RESIN ENCAPSULATION TYPE SEMICONDUCTOR DEVICE
#6Positioning system
#7APPARATUS AND METHOD FOR TREATING A SUBSTRATE
#8Bonding apparatus and wire bonding method
#9Imaging device for a bonding apparatus
#10Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device
#11Imaging device and method for a bonding apparatus
#12Imaging device and method for a bonding apparatus
#13WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
#14Semiconductor device and wire bonding method
#15Method and arrangement for producing a smart card
#16HEAT BLOCK
#17Horn attachment arm
#18Methods of connecting an antenna to a transponder chip
#19Method for fabricating chip-stacked semiconductor package
#20Wire bonding system and method of use
#21HEAT FIXTURE FOR WIRE BONDING
#22Partially patterned lead frames and methods of making and using the same in semiconductor packaging
#23Chip-stacked semiconductor package and method for fabricating the same
#24Method of marking a low profile packaged semiconductor device
#25Apparatus and method for indexing of substrates and lead frames
#26Wire bonding system and method of use