ClassID:

210622

H01L2224/78804 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors; Means for moving parts; Lower part of the bonding apparatus, e.g. XY table Translational mechanism

Recent Application in this class: