H01L2224/788 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors Means for moving parts

• H01L2224/78801 » Lower part of the bonding apparatus, e.g. XY table 11
• H01L2224/78821 » Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge 6
• H01L2224/78841 » of the pressing portion, e.g. tip or head 3