210623 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors; Means for moving parts Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
Sub-classes:WIRE BONDING SYSTEMS, WIRE BONDING TOOL REPLACEMENT SYSTEMS, AND RELATED METHODS
#2PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL
#3Wire bonding apparatus and manufacturing method for semiconductor apparatus
#4Method for calibrating wire clamp device
#5Curtain airbag device mounting structure and curtain airbag deployment method
#6Drive mechanism and manufacturing device
#7Short tail recovery techniques in wire bonding operations