210627 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors; Means for moving parts of the pressing portion, e.g. tip or head
Sub-classes:WIRE BONDING APPARATUS, CONTROL DEVICE, AND CONTROL METHOD
#2APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING
#3WIRE BONDING APPARATUS, WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
#4Apparatus and methods for tool mark free stitch bonding