ClassID:

210658

H01L2224/7917 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for Tape Automated Bonding [TAB]; Means for applying permanent coating Means for applying a preform, e.g. laminator

Sub-classes: