H01L2224/79 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto Apparatus for Tape Automated Bonding [TAB]

• H01L2224/79001 » Calibration means 0
• H01L2224/7901 » Means for cleaning, e.g. brushes, for hydro blasting, for ultrasonic cleaning, for dry ice blasting, using gas-flow, by etching, by applying flux or plasma 6
• H01L2224/791 » Means for controlling the bonding environment, e.g. valves, vacuum pumps 0
• H01L2224/7915 » Means for applying permanent coating 0
• H01L2224/792 » Protection means against electrical discharge 0
• H01L2224/7925 » Means for applying energy, e.g. heating means 0
• H01L2224/795 » Cooling means 0
• H01L2224/7955 » Mechanical means, e.g. for pressing, stamping 2
• H01L2224/796 » Means for supplying the connector to be connected in the bonding apparatus 0
• H01L2224/7965 » Means for transporting the components to be connected 11
• H01L2224/797 » Means for aligning 0
• H01L2224/798 » Means for moving parts 0
• H01L2224/799 » Means for monitoring the connection process 0
• H01L2224/7995 » Means for forming additional members 0
• H01L2224/7998 » specially adapted for batch processes 0
• H01L2224/79981 » Apparatus chuck 0

Recent Application in this class: