H01L2224/795 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for Tape Automated Bonding [TAB] Cooling means

• H01L2224/79501 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 0
• H01L2224/79502 » in the upper part of the bonding apparatus, e.g. in the pressing head 0